Wei-Ping Dow, Professor
Tel:+886-4-2285-9152 ;+886-4-2284-0510 ext. 901
E-mail: dowwp@dragon.nchu.edu.tw

Educational background:

Ph.D. of Chemical Engineering, National Tsing Hua University (1995), Taiwan.

 

 

Active position

Tenured Distinguished Professor, National Chung Hsing University, Taiwan.

 

 

Professional specialty

Electroplating, Electroless deposition, Formulation and process Development for electronic devices and products fabrication

 

 

Honor
  • National Industrial Innovation Award, Ministry of Economic Affairs, Taiwan, 2019.
  • Breakthrough Award of Future Technology, Ministry of Science and Technology, Taiwan, 2018.
  • Outstanding Performance Award of Technology Alliance Project, Ministry of Science and Technology, Taiwan, 2018.
  • Outstanding Award of Technology Transfer, National Chung Hsing University, Taiwan, 2017.
  • Outstanding Research Award, Ministry of Science and Technology, Taiwan, 2015.
  • Excellent Research Award, National Chung Hsing University, Taiwan, 2011 and 2014.
  • Outstanding Industry Collaboration Award, Engineering College, National Chung Hsing University, Taiwan, 2012, 2015, 2018, 2019.
  • Excellent Industry Collaboration Award, Engineering College, National Chung Hsing University, Taiwan, 2011, 2013 and 2014.
  • Outstanding Research Award of LCY Chemical Education Foundation, Taiwan, 2011.

 

Teaching subject
Publications
  1. Hsuan Lee, Shan-Ting Tsai, Ping-Heng Wu, Wei-Ping Dow, Chih-Ming Chen*, 2019, “Influence of Additives on Electroplated Copper Films and Their Solder Joints”, Mater. Character., 147, pp. 57-63.
  2. Shuehlin Yau*, Yutang Huang, Wei-Ping Dow*, and Yuh-Lang Lee*, 2018, “Contrasts in Copper Deposition on Pt(111) Modified by 1-Mercaptopropionic and 1-Mercaptoacetic Acids as Probed by Voltammetry and STM”, J. Electrochem. Soc., 165, pp. D761-D767.
  3. Chun-Cheng Lin, Chih-Han Yen, Sheng-Chi Lin, Chi-Chang Hu* and Wei-Ping Dow*, 2017, “Interactive Effects of Additives and Electrolyte Flow Rate on the Microstructure of Electrodeposited Copper Foils”, J. Electrochem. Soc., 164, pp. D810-D817.
  4. Chia-Wen Cheng, Po-Fan Chan, and Wei-Ping Dow*, 2017, “Direct Copper Pattern Plating on Glass and Ceramic Substrates Using an Al-Doped ZnO as an Adhesive and Conducting Layer”, J. Electrochem. Soc., 164, pp. D687-D693.
  5. Po-Fan Chan, Rung-Hsuan Ren, Shih-I Wen, Hou-Chien Chang, and Wei-Ping Dow*, 2017, “Effects of Additives and Convection on Cu Foil Fabrication with a Low Surface Roughness”, J. Electrochem. Soc., 164, pp. D660-D665.
  6. Hsuan Lee, Tai-Yi Yu, Hsi-Kuei Cheng, Kuo-Chio Liu, Po-Fan Chan, Wei-Ping Dow* and Chih-Ming Chen*, 2017, “Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints”, J. Electrochem. Soc., 164, pp. D457-D462.
  7. Tai-Yi Yu, Hsuan Lee, Hsuan-Ling Hsu, Wei-Ping Dow, Hsi-Kuei Cheng, Kuo-Chio Liu, and Chih-Ming Chen*, 2016, “Effects of Cu Electroplating Formulas on the Interfacial Microstructures of Sn/Cu Joints”, J. Electrochem. Soc., 163, pp. D734-D741.
  8. Tzu-Chi Chen, Yao-Lin Tsai, Chia-Fu Hsu, Wei-Ping Dow*, and Yasuo Hashimoto, 2016, “Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes”, Electrochim. Acta, 212, pp.572-582.
  9. Lai-Han Li, Shuehlin Yau*, and Wei-Ping Dow*, 2016, “In situ STM Imaging of Polyethylene Glycol Adsorbed on an Au(111) Electrode in pH3”, Electrochemistry Communications, 70, pp. 1-4.
  10. Chao-Shan Lai, Xiao-Xuan Hu, Shuehlin Yau*, Wei-Ping Dow*, Yuh-Lang Lee*, 2016, “Electrodeposition of Copper on an Au(111) Electrode Modified with Mercaptoacetic Acid in Sulfuric Acid”, Electrochim. Acta, 203, pp. 272-280.
  11. Guo-Rong Lin, John Biechele-Speziale, Elijah Ernst, Stuart Burris*, Eric D. Conte*, Wei-Ping Dow, Rong-Ho Lee, Shing-Yi Suen*, 2016, “Trap and Release of Bisphenol-A, 2-Naphthol, and Doxepin Using a 1-Hexadecylamine-copper(II)-amine Functionalized Indium-tin-oxide Electrode”, Chem. Eng. J., 295, pp. 245-253.
  12. Chia-Fu Hsu, Wei-Ping Dow*, Hou-Chien Chang, and Wen-Yu Chiu, 2015, “Optimization of the Copper Plating Process Using the Taguchi Experimental Design Method I. Microvia Filling by Copper Plating Using Dual Levelers”, J. Electrochem. Soc., 162, pp. D525-D530.
  13. Yu-Tien Lin, Hsin-Man Huang, Hsin-Wei Wang, Wei-Ping Dow*, Jing-Yuan Lin, Ping-He Chang, and Horn-Chin Lee, 2015, “Microvia Filling with Nickel-Tungsten Alloy to Decrease the Coefficient of Thermal Expansion of Electronic Circuit Interconnections”, ECS Electrochem. Lett., 4, pp. D25-D27.

 

 

  • 會議論文
    1. Wei-Ping Dow*(Keynote Speaker), 2019, the 18th International Symposium on Microelectronics and Packaging jointed with the 21st International Conference on Electronic Materials and Packaging (ISMP-EMAP 2019), November 13-15, Hotel Aqua Palace, Busan, Korea.
    2. Wei-Ping Dow*(Invited Speaker), 2019, 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, May 21-25, Kanazawa, Ishikawa-prefecture, Japan.
    3. (優勝獎) I-Hsuan Chang, Shuo-Wen Chang, Hung-Chun Keng and Wei-Ping Dow*, 2019, “Electroplating Technology of Reduced Graphene Oxide for PCBs”, 台灣化學工程學會第65周年年會，化工與材料工程學系，11月09-10日，國立雲林科技大學，斗六，臺灣。
    4. Wei-Ping Dow*(Invited Speaker), I-Hsuan Chang, Yi-Yung Chen, Wei-Yang Zeng, Shih-Cheng Chang, Po-Fan Chan and Chun-Hsiang Lo, 2019, “Advanced Electroplating Technologies for 2.5D and 3D Chip Packaging Fabrication”, Materials Engineering and Process Optimization at Electrified Solid/Liquid Interfaces, TMS 2019, 148th Annual Meeting, March 10-14, San Antonio, Texas, USA.
    5. Wei-Ping Dow*(Keynote Speaker), I-Hsuan Chang, Yi-Yung Chen, Wei-Yang Zeng, Shih-Cheng Chang, Po-Fan Chan and Chun-Hsiang Lo, 2018, “TSV Fabrication Using Reduced Graphene Oxide and Cu Bump Electroplating with Annealing-free Single Crystal Structure”, The 19th International Conference on Electronic Packaging Technology (ICEPT), August 8-11, Shanghai, China.
    6. Wei-Ping Dow* (Invited Speaker), I-Hsuan Chang, Yi-Yung Chen, Wei-Yang Zeng, Shih-Cheng Chang, Po-Fan Chan and Chun-Hsiang Lo, 2018, “Advanced Electroplating Technologies for 2.5D and 3D Chip Packaging Fabrication”, Materials Engineering and Process Optimization at Electrified Solid/Liquid Interfaces, 22nd Topical Meeting of the International Society of Electrochemistry 15-18 April, Tokyo, Japan.
    7. （金牌獎）I-Hsuan Chang, Yi-Yong Chen and Wei-Ping Dow*, 2017,“Using Reduced Graphene Oxide (rGO) as a Conducting Layers for a PCB Metallization”, International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, Oct. 25-27, Taipei, Taiwan.
    8. （銀牌獎）Po-Ting Chen, Liang-Jie Lin and Wei-Ping Dow*, 2017, “Copper Superfilling of Through Silicon Via and Through Glass Via Using Reduced Graphene Oxide”, International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, Oct. 25-27, Taipei, Taiwan.
    9. （佳作）Yao-Lin Tsai, I-Hsuan Chang, Tzu-Chi Chen, Hong-Ming Chang, Yi-Chun Chung, Wei-Ping Dow*, and Yasuo Hashimoto，2016，“A Synthesis Approach of Cu Nanoparticles and Their Application on Electroless Cu Deposition”，台灣化學工程學會63週年年會，11月25-26日，桃園，中央大學，台灣。
    10. （優選獎）Wei-Yang Zeng, Yi-Yong Chen and Wei-Ping Dow*, 2016, “Copper Electroplating of a Printed Circuit Board Using Reduced Ggaphene Oxide as a Cconducting Layers”, International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, Oct. 26-28, Taipei, Taiwan.
    11. 竇維平*（Invited speaker），2016，“研究與研發的差異與互補-電鍍技術與配方”，2016台灣化學工程學會63週年年會，化工與材料工程學系，11月25-26日，國立中央大學，桃園，臺灣。
    12. 竇維平*(Invited Speaker)，2016，“界面化學在電子產業上的應用”，中華民國界面科學學會年會，6月24日，國立台灣大學，台北，台灣。
    13. 竇維平*(Invited Speaker)，2016，“利用電鍍銅填充高密度內連接電路板之通、盲孔”，華東電路板暨表面貼裝展覽會 (CTEX)，5月19日，蘇州，上海，中國。
    14. （佳作）蔡耀麟、陳祖啟、竇維平*，2015，“Chemical Reduction of CuNPs by Heterophasic Synthesis and Their Application on a Printed Circuit Board”，台灣化學工程學會62週年年會，11月6日，高雄，義守大學，台灣。
    15. （優等獎）Chu-Chi Liu, Yu-Tien Lin, Hsin-Man Huang, Hsin-Wei Wang and Wei-Ping Dow*, 2015, “Microvia Filling with Nickel-Tungsten Alloy to Decrease the Coefficient of Thermal Expansion of Electronic Circuit Interconnections”, International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, Oct. 21-23, Taipei, Taiwan.
    16. （優等獎）Shih-I Wen, Mao-Chun Hung, Po-Fan Chan, Wei-Ping Dow*, 2015, “Electro- deposited Copper Foil for High-frequency Printed Circuit Boards”, the 10th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, October 21-23, Taipei, Taiwan.
    17.  (最佳論文獎) Mao-Chun Hung, Po-Fan Chan and Wei-Ping Dow*, 2015, “Effect of Plating Additives on Microstructure and Properties of Electrodeposited Ni-Fe Alloy”, Symposium 07-Electrodeposition-The Frontier Approach in Material Science and Nanofabrication, 66th ISE Meeting, October 4-9, Taipei, Taiwan.
    18. Wei-Ping Dow*(Invited Speaker), 2015, “Microvia and through-Hole Filling By Electroplating for Electronic Circuit Fabrication”, 47th Autumn Meeting, The Society of Chemical Engineers, Japan, September 9-11, Hokkaido University, Sapporo, Japan.
    19. Wei-Ping Dow*(Invited Speaker), 2015, “Microvia and through-Hole Filling By Electroplating for Electronic Circuit Fabrication”, Session E02 Surfactant and Additive Effects on Thin Film Deposition, Dissolution, and Particle Growth, 227th ECS Meeting, May 24-28, Chicago, Illinois, USA.

 

  • 專利
    1. 竇維平、詹博帆，2019，“免熱處理製備超大晶粒銅之方法、電解液、包含超大晶粒銅之銅箔及電子元件連接結構”，中華民國發明專利，專利號碼：I 653364。
    2. 竇維平、謝承蓉，2018，“高穩定性奈米金屬粒子、製造方法及穩定劑”，中華民國發明專利，專利號碼：I 633957。
    3. 竇維平、陳柏廷、林良杰、張弘明、林庭筠、林芳瑜，2018，“製備高透光率軟性導電材的方法及該導電基材”，中華民國發明專利，專利號碼：I 629375。
    4. 竇維平、葉錠強、楊豐吉，2018，“印刷電路板的線路與層間導通之製造方法”，中華民國發明專利，專利號碼：I 628989。
    5. 竇維平、張弘明、蔡耀麟、陳祖啟，2018，“化學鍍銅的前處理方法及其使用的銅離子錯合物觸媒溶液及調節液”，中華民國發明專利，專利號碼：I 626989。
    6. 竇維平、溫士誼、麥智鈞，2017，“銅電鍍液之組成及其電鍍銅填孔結構”，中華民國發明專利，專利號碼：I 607121。
    7. 竇維平、曾為揚、陳依詠，2017，“使基本表面及高深寬比孔洞之孔壁具有還原氧化石墨烯層之方法及該方法所使用的調節液”，中華民國發明專利，專利號碼：I 586849。
    8. 竇維平、王美齡，2016，“微孔填充之電鍍銅系統”，中華民國發明專利，專利號碼：I 537432。
    9. 竇維平、張世誠，2016，“將還原氧化石墨烯層修飾於基板孔洞表面的方法”，中華民國發明專利，專利號碼：I 522499。
    10. 竇維平、黃馨嫚，2015，“半導體元件高深寬比(HAR)孔洞或槽渠之鎳鎢合金填孔電鍍液及填孔製程”，中華民國發明專利，專利號碼：I 506727。
    11. 竇維平、沈紹平，2015，“矽烷基團層自組裝膜之改質劑，以及利用該改質劑之玻璃表面金屬化方法”，中華民國發明專利，專利號碼：I 499655。
    12. 竇維平、廖春暉，2015，“於塑料基材表面形成導電金屬圖案或佈線的方法及該方法中所使用的噴印墨水”，中華民國發明專利，專利號碼：I 500370。
    13. Wei-Ping Dow, Shih-Cheng Chang，2015, “Method of Coating Surface of Substrate Hole with Layer of Reduced Graphene Oxide”, USA Patent, Patent No. US9105696 B1.
    14. 竇維平、許家福，2015，“於半導體元件中形成高深寬比（HAR）特徵結構之電化學蝕刻方法”，中華民國發明專利，專利號碼：I 494989。
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