陳志銘( Chih-Ming Chen)
Home Faculty & Staff Adjunct Chair Professor
陳志銘( Chih-Ming Chen)
職稱   本校特聘教授兼生發中心主任
電話 (04)22859458
E-mail   chencm@dragon.nchu.edu.tw
辦公室  511
個人網址   http://web.nchu.edu.tw/~cmchen/
最高學歷  國立清華大學化學工程學系 博士
研究領域 太陽能電池、微電子材料、IC封裝、LED固晶
簡要經歷
國立清華大學化學工程學系 學士 (1997) 
國立清華大學化學工程學系 博士 (2002) 
國立中興大學化學工程學系 助理教授 (2004-2007) 
國立中興大學化學工程學系 副教授 (2007-2011)
國立中興大學化學工程學系 教授(2011-)
Teaching subject
Publications
A.期刊論文
  1. B.-H. Liou, C.-M. Chen*, R.-H. Horng, Y.-C. Chiang, and D.-S. Wuu, “Improvement of thermal management of high-power GaN-based light-emitting diodes,” Microelectronics Reliability, in press., 2011. (SCI)
  2. J.-L. Lan, C.-C. Wan, T.-C. Wei, W.-C. Hsu, C. Peng, Y.-H. Chang, and C.-M. Chen*, “Improvement of Photovoltaic Performance of Dye-Sensitized Solar Cell by Post Heat Treatment of Polymer-Capped Nano-Platinum Counterelectrode,” International Journal of Electrochemical Science, in press. , 2011. (SCI)
  3. C.-P. Lin and C.-M. Chen*, “Solid-state interfacial reactions at the solder joints employing Ni/Pd/Au and Ni/Au as the surface finish metallizations,” Microelectronics Reliability, in press. , 2011. (SCI)
  4. C.-M. Chen* and S.-J. Cherng, “Counterelectrodes for Dye-sensitized Solar Cells,” Global Journal of Physical Chemistry, in press.(Invited review article), 2011. (SCI)
  5. S.-J. Cherng, C.-M. Chen*, W.-P. Dow, C.-H. Lin, and S.-W. Chen, “Chemical deposition of Ni/Pt bi-layer on polyimide film as flexible counterelectrodes for dye-sensitized solar cells,” Electrochemical and Solid-State Letters, Vol. 14, pp. P13-P15. , 2011. (SCI)
  6. Y.-T. Huang, C.-M. Chen*, Y.-W. Lin, “Characterization of carbon nanomaterials synthesized from thermal decomposition of paper phenolic board,” Materials Chemistry and Physics, Vol. 127, pp. 397-404., 2011. (SCI)
  7. C.-P. Lin, C.-M. Chen*, Y.-W. Yen, H.-J. Wu, S.-W. Chen, “Interfacial reactions between high-Pb solders and Ag,” Journal of Alloys and Compounds, Vol. 509, pp. 3509-3514., 2011. (SCI)
  8. C.-M. Chen*, Y.-C. Hsu, and S.-J. Cherng, “Effects of annealing conditions on the properties of TiO2/ITO-based photoanode and the photovoltaic performance of dye-sensitized solar cells,” Journal of Alloys and Compounds, Vol. 509, pp. 872-877., 2011. (SCI)
  9. J.-Y. Wang, C.-F. Lin, and C.-M. Chen*, “Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.％ Zn/Cu interface,” Scripta Materialia, Vol. 64, pp. 633-636., 2011. (SCI)
  10. C.-J. Chen, C.-M. Chen*, R.-H. Horng, D.-S. Wuu, and J.-S. Hong, “hermal management and interfacial properties in high-power GaN-based light-emitting diodes employing diamond-added Sn-3wt.％Ag-0.5wt.％Cu solder as die attach materials,” Journal of Electronic Materials(Editor’s Choice + Featured Article), vol.39, pp.2618-2626, 2010. (SCI)
  11. S.-J. Cherng, Y.-C. Hsu, and C.-M. Chen*, “Mitigation of Solvent Evaporation in Dye-Sensitized Solar Cells Based on Liquid Electrolyte by Introducing Regular-fencing-patterned Polymer Films,” Journal of the Chinese Institute of Engineers, Vol. 33, pp. 791-797., 2010. (SCI)
  12. J.-S. Hong, R.-H. Horng*, Y.-L. Tsai, D.-S. Wuu, C.-M. Chen, and C.-J. Chen, “Optimized Thermal Management from Chip to Heat Sink for High-Power GaN-Based Light-Emitting Diodes,” IEEE Transactions on Electron Devices, Vol. 57, pp. 2203-2207., 2010. (SCI)
  13. C.-P. Lin, C.-M. Chen*, C.-H. Lin, and W.-C. Su, “Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate,” Journal of Alloys and Compounds, Vol. 502, pp. L17-L19. , 2010. (SCI)
  14. 1Y.-W. Lin, P.-Y. Shih, and C.-M. Chen*, “A current-induced localized heating technique for fabrication of carbon nanomaterials,” Journal of Alloys and Compounds, Vol. 492, pp. 521-524., 2010. (SCI)
  15. C.-M. Chen*, C.-H. Chen, S.-J. Cherng, and T.-C. Wei, “Electroless deposition of platinum on indium tin oxide glass as the counterelectrode for dye-sensitized solar cells,” Materials Chemistry and Physics, Vol. 124, pp. 173-178., 2010. (SCI)
  16. C.-M. Chen*, C.-H. Chen, and T.-C. Wei, “Chemical deposition of platinum on metallic sheets as counterelectrodes for dye-sensitized solar cells,” Electrochimica Acta, Vol. 55, pp. 1687-1695. , 2010. (SCI)
  17. C.-M. Chen*, H.-S. Shiu, S.-J. Cherng, and T.-C. Wei,, “Preparation of polymer film of micro-porous or island-like structure and its application in dye-sensitized solar cell,” Journal of Power Sources, vol.188, pp.319-322, 2009. (SCI)
  18. H.-M. Chung, C.-M. Chen*, C.-P. Lin, and C.-J. Chen, “Microstructural Evolution of the Au-20 wt.％ Sn Solder on the Cu Substrate During Reflow,” Journal of Alloys and Compounds, vol.485, pp.219-224, 2009. (SCI)
  19. C.-P. Lin and C.-M. Chen*, “Intermetallic compound formation and evolution in the solid-state Sn/immersion-Ag/Cu tri-layer interfacial reactions on a flexible polymer board,” Journal of Electronic Materials, vol.38, pp.908-914, 2009. (SCI)
  20. C.-M. Chen* and Y.-J. Chen, “Growth orientation of the tin whiskers on an electrodeposited Sn layer under three-point bending,” Materials Letters, vol.63, pp.1517-1520, 2009.
  21. C.-M. Chen*, Y.-M. Hung, and C.-H. Lin, “Electromigration of Sn-8 wt.％ Zn-3 wt.％ Bi and Sn-9 wt.％ Zn-1 wt.％ Cu solders,” Journal of Alloys and Compounds, vol.475, pp.238-244, 2009. (SCI)
  22. C.-M. Chen*, Y.-M. Hung, C.-P. Lin, and W.-C. Su, “Effect of temperature on microstructural changes of the Sn-9 wt.％ Zn lead-free solder stripe under current stressing,” Materials Chemistry and Physics, vol.115, pp.367-370, 2009.
  23. Y.-J. Chen and C.-M. Chen*, “Mitigative tin whisker growth under mechanically applied tensile stress,” Journal of Electronic Materials, vol.38(3), pp.415-419, 2009. (SCI)
  24. C.-M. Chen*, P.-Y. Shih, and Y.-W. Lin, “Synthesis of nanostructured carbon materials on a tin thin film using phenol formaldehyde as the carbon source,” Journal of Electronic Materials, vol.38(1), pp.193-199, 2009.
  25. C.-H. Chen, C.-P. Lin, and C.-M. Chen*, “Effect of Cu thickness on the evolution of the reaction products at the Sn-9 wt.％ Zn solder/Cu interface during reflow,” Journal of Electronic Materials, vol.38(1), pp.61-69, 2009.
  26. J.-S. Hong, R.-H. Horng*, Y.-L. Tsai, D.-S. Wuu, C.-M. Chen, and C.-J. Chen, “Optimized Thermal Management from Chip to Heat Sink for High-Power GaN-Based,” IEEE Transactions on Electron Devices, under review, 2009. (SCI)
  27. C.-M. Chen*, Y.-J. Chen, C.-P. Lin, and W.-K. Liao, “Solid state Sn/Cu interfacial reactions under three-point bending,” Journal of Electronic Materials, under revision, 2009. (SCI)
  28. C.-M. Chen*, C.-H. Chen, S.-J. Cherng, and T.-C. Wei, “Electroless deposition of platinum on indium tin oxide glass as the counterelectrode for dye-sensitized solar cells,” Materials Chemistry and Physics, under revision. , 2008.
  29. C.-M. Chen* and P.-Y. Shih, “A peculiar composite structure of carbon nanofibers,” Journal of Materials Research, vol.23(10), pp.2668-2673, 2008. (SCI)
  30. C.-M. Chen*, C.-H. Chen, and C.-P. Lin, and W.-C. Su, “Morphological evolution of reaction product at Sn-9 wt.％ Zn/thin-film Cu interface,” Journal of Electronic Materials, vol.37(10), pp.1605-1610, 2008.
  31. Y.-M. Hung and C.-M. Chen*, “Electromigration of Sn-9 wt.％ Zn solder,” Journal of Electronic Materials, vol.37(6), pp.887-893, 2008.
  32. C.-M. Chen* and C.-C. Huang, “Atomic migration in eutectic SnBi solder alloy due to current stressing,” Journal of Materials Research, vol.23(4), pp.1051-1056, 2008.
  33. C.-M. Chen and C.-H. Chen, “Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substrates,” Journal of Electronic Materials, 2007. (SCI)
  34. C.-M. Chen and C.-C. Huang, “Effects of silver doping on electromigration of eutectic SnBi solder,” Journal of Alloys and Compounds, 2007. (SCI)
  35. C.-M. Chen, K.-Z. Wang, and K.-C. Chen, “Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallization,” Journal of Alloys and Compounds, vol.432, pp.122-128, 2007. (SCI)
  36. T.-C. Wei, C.-C. Wan, Y.-Y. Wang, and C.-M. Chen, and H.-S. Shiu, “Immobilization of Poly (N-vinyl-2-pyrrolidone)-capped Platinum Nano-clusters on Indium-tin oxide Glass and its application in Dye-sensitized Solar Cells,” Journal of Physical Chemistry C, vol.111, pp.4847-4853, 2007. (SCI)
  37. C.-M. Chen, C.-C. Huang, C.-N. Liao, and K.-M. Liou, “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing,” Journal of Electronic Materials, vol.36(7), pp.760-765, 2007. (SCI)
  38. C.-M. Chen, L.-T. Chen, and Y.-S. Lin, “Electromigration-induced Bi segregation in eutectic SnBi solder joint,” Journal of Electronic Materials, vol.36(2), pp.168-172, 2007. (SCI)
  39. C.-M. Chen and H.-C. Lin, “Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls,” Journal of Electronic Materials, vol.35(11), pp.1937-1947, 2006. (SCI)
  40. L.-T. Chen and C.-M. Chen, “Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization,” Journal of Materials Research, vol.21(4), pp.962-969, 2006. (SCI)
  41. K.-Z. Wang and C.-M. Chen, “Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with the Ti/Cu/Ni under bump metallization during reflow soldering,” Journal of Electronic Materials, vol.34(12), no.2461-2469, pp.1543-1549, 2005. (SCI)
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